美隆電子有限公司

Mayloon Electronic Co., Ltd.,

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Company Profile

E-mail 列印

Company Profile:

We Mayloon Electronic Company Limited has established since 1990, we are a registered Hong Kong companyWe are a leading manufacturer of Chip Diode, Resistor, Capacitor, NTC Sensor, Lighting Products, etc......

All had been approved with  RoHS  certificates.

We are professional and customers oriented, aiming to become the most professional supplier in our field and to obtain the support and trust from more customers.

To cater for the various needs of different customers in China and Hong Kong, we aim to expand our business continuously by providing quality products and professional service.

 

Company Name:

Mayloon Electronic Company Limited (1990)

Mayloon Lighting Company Limited (2006)

Country/Region :

Hong Kong

Establishment:

1990

Capital:

2,000,000.00(HKD)

Business:

Manufacturer, Supplier, Trader, Wholesaler and Distributor.

Contact Information:

Company Name:

Mayloon Electronic Company Limited 美隆電子有限公司

Mayloon Lighting Company Limited美隆照明有限公司

Location:

17E, Houston Industrial Bldg., 32-40 Wang Lung Street, Tsuen Wan, N.T.

Tel/Fax:

TEL +852-24089788; FAX +852-24069983

Email:

這個 E-mail 地址已經被防止灌水惡意程式保護,您需要啟用 Java Script 才能觀看

Website:

http://www.mayloon.com

Representative:

Lo Yin Yin

Brand Name:

SINLOON®

Trade Mark No.:

(9) 300541412 (HK)  (9) 6908857 (CN)

(11) 302892213 HK  (11) 14158386 (CN)

Bank Information:

A/C Name:

Mayloon Electronic Company Limited (美隆電子有限公司)

Bank Name:

Shanghai Commercial Bank Ltd. Texaco Road Branch

Swift Code:

SCBKHKHHXXX

A/C No. (USD)

34528-00012-1

A/C No. (HKD)

345-82-01782-5

A/C Name:

Mayloon Lighting Company Limited (美隆照明有限公司)

Bank Name:

Shanghai Commercial Bank Ltd. Texaco Road Branch

Swift Code:

A/C No. (USD)

A/C No. (HKD)

345-14-31168-9

 
歡迎您瀏覽本網站 WELCOME TO MAYLOON
Mayloon Electronic Company Limited Mayloon Lighting Company Limited

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Newsflash

LED 芯片封裝技術
產品應用 LED 芯片封裝技術
基板芯片封裝工藝技術有兩種形式: 一種是板上芯片封裝(COB)技術,它採用了絲焊的
方法在硅片和基底之間用引線直接建立電極連接,並用樹脂覆蓋保護以确保它的可靠性。
但它的封裝密度遠不及倒片焊封裝技術。
- 另一種是倒裝芯片(FLIP CHIP)技術,一種無引腳錶面封裝結構,一般含有電路單元,
設計用於通過適當數量的位於其面上的錫球,在電氣上和機械上連接於電路,然後將芯片
翻轉加熱利用熔接的錫鉛球與基板結合,此封裝熔接技術替換了常規打線連接電極的方法
- ,將漸會是未來的LED芯片封裝主流。
COB相比, FLIP CHIP封裝形式的芯片結構和輸入/(I/O)(焊鍚球)方向朝下,
原於I/O引端分佈於整個芯片錶面,故在封裝密度和處理速度上 FLIP CHIP 己達最佳效果
- ,特別是它可以採用SMT技術的手段來加工,因此是LED芯片封裝技術及高蜜度安裝的最
終使用方法。FLIP CHIP 封裝技術與傳統的COB的引線結合工藝相比具有許多明顯的
優點,包括優越的電學及熱學性能,高I/O引腳數,封裝尺寸更小。